[ES3J-SMAF] ES3JAF,ES3GAF,ES3DAF,ES3KAF,ASEMI ultrafast recovery

TypeES3JAF

BrandASEMI

PackageSMAF

FeatureSuper recovery

lo	VRRM	Chip Material	Chip Number	lr	Temperature
3A	50V~1000V	GPP(si)	1	5uA	-50℃~150℃
VF	IFSM	Chip Size	Lead Number	Trr	Package
1.05V~1.50V	100A	88MIL	2	35ns	3Kpcs/T&R 6Kpcs/box

●Adopts high-quality process chip, which has good sealing reliability and prevents electrical degradation

●Laser marking is not easy to fade and prevent refurbishment; epoxy resin grease has good stability

●Oxygen-free copper frame pins, bright tin plating to prevent oxidation, small internal resistance, good conductivity

●Adopt 5 layers of large corrugated kraft paper box, 4 layers of restraint belt protection

●The inner box is protected by moisture-proof plastic film, which is convenient for long-term storage in the warehouse

Purchase:

400-9929-667

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PRODUCT PARAMETERS

Video content details：

ASEMI brand MB6S,MBS series，it adopts high-quality process chip with high stability, highly consistent product dispersion etc features.This product is ASEMI original product, the quality is stable and reliable.Welcome to apply for free sample test.

Video content details：

DETAIL

Adopts high-quality process chip, which has good sealing reliability and anti-electricity decline.

Laser marking, not easy to fade; epoxy resin molding, good insulation stability.

The frame pins are made of oxygen-free copper material, with small internal resistance, good conductivity.

Independent small package to prevent material backlog collision and scratch, product information clearly marked.

5 layers of large corrugated kraft paper box, 4 fastening belt protection, pressure and wear resistance can be reused.

3-layer small corrugated inner box + moisture-proof plastic film protection, convenient to store and easy to solder on the machine.

DESCRIPTION

GREEN LASER PRINTER

●laser marking is not easy to fade, to solve the ink screen printing easy fade

●high production efficiency of laser marking, short delivery time, solve the problem of long delivery time and low efficiency of ink printing

PLASTIC PACKAGING

●disposable injection molding with epoxy resin material

●good flame retardant performance, high strength, high temperature resistance

OXYGEN-FREE COPPER PINS

●oxygen free copper, good electrical conductivity

●pin thickening design, thickness up to 0.9mm, can work for a long time without heating

●the LOGO of the original "ASEMI" brand

●A = advanced

●SEMI = semiconductor

●The three bars represent the positive poles

●Safety testing and identification authority

●Safety inspection product yield labeling

PRODUCT ANALYSIS

●[ES3JAF] represents the complete model of the product

●[ES] stands for the super fast recovery diode

●[3] means its forward current is 3a

●[J] represents its reverse withstand voltage is 600V

●[AF] represents it's belong to SMAF

SIZE

Body Height ：

4.75mm

Body Width ：

2.57mm

Lead Length ：

0.63mm

lead width ：

1.38mm

thickness：

0.097mm

Lead Spacing：

3.68mm

Lead Thickness：

0.13mm

PROCESS

Product

stability

Product stability

Adopt high-quality process chip, the product continues to be stable

Accurate product quantity

Accurate product quantity

Strict packaging inspection procedures to ensure that the product quantity is accurate, packaging without damage

One-step injection molding

One-step injection molding

Automated equipment supports injection molding in one step

Passed 6 quality checks

Passed 6 quality
checks

12 parameters such as Vb, Io, If, Vf, and Ir are detected through 6 channels, and ΔV is controlled within 80V to improve the consistency and reliability of 4 chips.

Interpersonal interaction

Interpersonal interaction

Reinforcement, cutting, separation, nterpersonal interaction process