Do you know the reason for the heat dissipation of the rectifier bridge D50SB100?

First, ASEMI engineers will give you a brief introduction to the electrical parameters of the D50SB100: D50SB100. This rectifier bridge is a kind of rectifying flat bridge. Its electrical parameter is 50A1000V. This large electrical parameter range guarantees the application of this product. The 50A high current and 1000V high withstand voltage circuit design can work for a long time and maintain a sufficient safety margin. Therefore, this rectifier bridge is also a commonly used rectifier bridge for ASEMI applications in high-power power supplies and commercial induction cookers. In addition to the basic current and voltage parameters, the important parameters of the rectifier bridge are shown in the figure below. Of course, we can also judge the quality of the D50SB100 rectifier bridge by the following parameters. Let's take a look.

After understanding the parameters of the product, let's take a look at the appearance of this rectifier bridge! Regarding the size specifications of the D50SB100, several important specifications are: length, thickness, and foot pitch. These numerical values are directly related to the design and process at the time of production. Some inferior manufacturers do not have the production strength, and the difference is a thousand miles. The difference of 1mm will also lead to the mistake of the last machine process, resulting in irreparable loss. ASEMI  integrated production equipment, precision design cutting, laser marking, to ensure that the rectifier bridge is formed at one time, the specific data is shown below.

Last , the characteristics of the D50SB100 is an important factor in distinguishing the quality of the rectifier bridge. ASEMI brand rectifier bridge D50SB100 comes with a thin aluminum heat sink specially produced, one of which has good ductility, one is heat dissipation function; this prevents the temperature difference from affecting the sealing of the molded case, and also ensure 180mil the stability of the working environment of the GPP large chip makes the temperature of the long-term power-on work not too high and causes chip damage.