01

Before this, we will briefly introduce the glass passivation process. Compared with the traditional protective glue process, the glass passivation process sinters and melts the glass powder at about 800 degrees, melting the glass and the chip, instead of the traditional protection. The adhesive is only attached to the surface of the chip. Its advantage lies in external stress such as bending in the foot, thermal shock, or when the plastic package leaks. The ordinary protective glue process (OJ) is possible to protect the adhesive and the chip. The combination is not strong, resulting in failure of the protection, resulting in device damage. However, due to the process of the GPP chip, there is no separation between the protection layer and the chip, so there is no device failure.

02

The second advantage of the glass passivation process and the traditional protective glue process is its stable performance and high temperature resistance. First of all, in terms of stability, the glass passivation process itself is less than the traditional process, which is a technical improvement. Especially for HTRB (High Temperature Reverse Bias), the glass passivation process is much better, while the traditional protective glue process can only withstand HTRB of about 100 degrees, while the glass passivation process is performed when GPP reaches 150 degrees. Still outstanding.

03

At present, ASEMI  factory has a talent team with research and development and manufacturing practices, including 27 engineers and senior management personnel in electronics, machinery and engineering management. They will develop more than 20 patented technologies. Good results in Schottky diodes, bridge rectifiers and silicon wafer production lines. The Shenzhen ASEMI sales team is also booming and the products are sold overseas.