【ASEMI】 Adopting Taiwan's Guanghua equipment to realize the whole wafer technology reconstruction, no collision, similar parameters, improve the consistency and high reliability of 4 chips

【ASEMI】screen printing solder paste to ensure the uniformity of solder paste, CCT automatically detects the uniformity and position of solder paste; ensure that the empty interview is less than 10%

【ASEMI】 adopts ultra-short 3m fast contact welding furnace and adopts special ice water circulation cooling system to realize instantaneous temperature impact production process of 180 seconds. The finished product has good stability and can adapt to various extreme use scenarios.

【ASEMI】Transfer from plane to groove depth. The design of the trench technology (TBR) achieves an LOW VF ultra low value.